RCT i-BlackTex

inline production of Black Silicon

RCT i-BlackTex

The first inline & cost effective solution
for black silicon texturing of DWS wafers

 

RCT i-BlackTex technology joins the whole process of state-of-the-art Black Silicon by inline MCCE in one single tool. 
RCT Solutions offers 3 different versions of the innovative and cost-effective RCT i-BlackTex technology.

 

 

 

RCT i-BlackTex

The All in One tool

  • From DWS wafer as cut to textured wafer ready for diffusion in one tool
  • <12m length @ 4,000 uph throughput

>> Download factsheet

 

RCT i-BlackUpgrade direct-attach

The RCT Black-Silicon upgrade tool allows upgrading existing texturization tools to state-of-the-art MCCE for DWS wafers

  • From DWS wafer as cut to nanostructured, Ag cleaned wafers (wet)
  • For direct attachment to existing texturing tool
  • <6m length @ 4,000 uph throughput

 

RCT i-BlackUpgrade stand-alone

If space in front of the texturization tool is not sufficient (or 8 /10 lane tool is used), a stand-alone upgrade tool is available

  • From DWS wafer as cut to nanostructured, Ag cleaned wafers (dry)
  • For installation anywhere in the cleanroom if space is a constraint
  • <6m length @ 4,000 uph throughput

Advantages

  • The whole process of state-of-the-art Black Silicon by inline MCCE in one single tool
  • Inline Processing at less than 12m length (up to 4,200 uph throughput)
  • Best in industry COO: 50% less cost compared to batch MCCE
  • No additves required
  • Stable process
  • Bath lifetime >500,000 wafers
  • RCT i-Black Upgrade available: upgrades existing texturing tools to Black Silicon processing

Lowest COO in industry. RCT i-BlackTex costs 1/2 of batch-type MCCE

Max. module power guaranteed by high Voc and FF

RCT i-BlackTex allows for inline production of Black Silicon. Only one tool is needed

Also available as upgrade tool to existing inline texuring tools

Interested in RCT i-BlackTex technology?
For further information contact our team.

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